流程简介：开料Cut Lamination－－钻孔Drilling－－干膜制程Photo Process(D/F)－－压合Lamination－－减铜Copper Reduction－－电镀Horizontal Electrolytic Plating－－塞孔Plug Hole－－防焊(绿漆/绿油)Solder Mask－－镀金Gold plating－－喷锡Hot Air Solder Leveling－－成型Profile－－开短路测试Electrical Testing－－终检Final Visual Inspection